We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Mask Aligner.
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Mask Aligner Product List and Ranking from 7 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

Mask Aligner Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 兼松PWS Kanagawa//Industrial Machinery
  2. 三明 Shizuoka//Industrial Electrical Equipment
  3. エイ・エス・エイ・ピイ Saitama//Electronic Components and Semiconductors
  4. 4 ナノテック Tokyo//Testing, Analysis and Measurement
  5. 5 ミカサ 本社・大阪営業所 Tokyo//Optical Instruments

Mask Aligner Product ranking

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. SUSS MicroTec Manual Mask Aligner MJB4 兼松PWS
  2. 三明MEMS【露光装置/マスクアライナー/ローコスト(低価格)】 三明
  3. UV-LED light source! Automatic exposure device for semiconductor manufacturing | Mask aligner エイ・エス・エイ・ピイ
  4. SUSS MicroTec Manual Mask Aligner MA/BAGen4 兼松PWS
  5. 4 Mask aligner ミカサ 本社・大阪営業所

Mask Aligner Product List

1~15 item / All 16 items

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No rear alignment! Single-sided automatic mask aligner AMA6000

By eliminating back alignment, we achieved a low price and compact design, making it an ideal device for small-batch production of various types.

The "AMA6000" is an automatic batch equal exposure mask alignment device. The ASAP mask aligner manages the gap between the mask and the wafer in a completely non-contact manner. While it can operate in non-contact mode, it also supports soft and hard contact. It achieves low cost, compact size, and easy operation. 【Features】 ■ Parallel exposure in complete non-contact ■ Space-saving & easy maintenance ■ Auto alignment ■ Achieves low cost and compact design, suitable for small-batch production of various types *For more details, please refer to the PDF document or feel free to contact us.

  • others

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三明MEMS【露光装置/マスクアライナー/ローコスト(低価格)】

研究開発から、少LOT多品種、量産まで対応する「手動・半自動・全自動」のローコストな露光装置/マスクアライナーをご提案!

 株式会社三明では、コンパクトな微細露光のスタンダード機「LAシリーズ片面マスクアライナー」や、 両面プロセスのローコストアシストモデル「BAシリーズ正面マスクアライナー」、両面・多面プロセスの スタンダード量産機である「BSシリーズ両面同時露光マスクアライナー」といった手動型の露光機をはじめ、 少ロット多品種から量産まで対応した半自動の「セミオートマスクアライナー」や全自動の「フルオートマスクアライナー」など、 優れたローコストな露光装置を多数取り揃えております。 *詳しくはお問い合わせ、もしくはカタログをご覧ください。

  • Wafer processing/polishing equipment

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Component-type mask aligner ES20

Low-cost single-sided aligner of the ES series

We build up the optimal mask aligner tailored to your specifications and budget. By selecting only the necessary units and options from various choices, we can create an easy-to-use device that minimizes unnecessary costs. We will listen to your requests and propose the best specifications. Additionally, most units can be added or replaced later, allowing for future upgrades and reductions in initial installation costs. You can choose from two types of UV light source devices (various exposure sizes) that accommodate samples from φ1 to 4 inches (including custom shapes like square samples) and masks from 2 to 5 inches. You can also select from various observation microscopes, including CCD cameras, stereo, and eyepiece types. It is compact and low-cost. For more details, please contact us or refer to the catalog.

  • Other inspection equipment and devices

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Experimental/Research Mask Aligner ES410

A mask aligner with sufficient functionality for photolithography at a low cost.

The ES410 mask aligner for experiments and research is a low-cost device that possesses sufficient functions necessary for photolithography. It is a fully manual machine suitable for various experiments, research, and learning about photolithography. With the wide customization options unique to the ES series, it can be set up to better fit specific purposes by selecting various units and options. Most units can be added or changed later, allowing for future upgrades. For more details, please contact us or refer to the catalog.

  • Other inspection equipment and devices

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High-Performance Mask Aligner LA Series

Compact fine exposure standard machine. 4/6/8 inch standard mask aligner.

The high-performance mask aligner LA series is a standard device for compact fine exposure with 4/6/8 inch standard mask aligners. It is an exposure device capable of high-resolution pattern exposure in research fields requiring photolithography, such as semiconductor device fabrication. It is equipped with a specially designed dual-objective two-field CCD microscope, allowing alignment of small samples with a minimum objective lens spacing of 18mm. It features a wipe device for simultaneous two-field monitoring display, and the Z-axis is driven by air pressure with a gap fine adjustment lever. It supports hard contact, soft contact, and proximity exposure. The parallel mechanism employs reliable spherical bearings for compactness and high versatility. For more details, please contact us or refer to the catalog.

  • Other inspection equipment and devices

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Dual-Sided Simultaneous Exposure Mask Aligner BS320

Simultaneous exposure of both sides of the wafer. Supports medium lot production with semi-automatic operation!

The BS320 dual-sided simultaneous exposure mask aligner has a proven track record in research and development as well as small to medium lot production. It adopts a method where the primary exposure is done simultaneously on both sides, and subsequent exposures are done one side at a time, making it a simple and versatile model. Customization to meet various needs is also available. Since the subsequent exposures are done on one side, a separate "sample stage" is required. The BS320u, which allows for simultaneous dual-sided exposure even after the primary exposure, is also part of the lineup. It supports semi-automatic operation for medium lot production. For more details, please contact us or refer to the catalog.

  • Other inspection equipment and devices

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Dual-Sided Simultaneous Exposure Mask Aligner 'BS425' 'BS620'

Simultaneous exposure of both sides of the wafer! Supports medium lot production with semi-automatic operation.

The dual-sided simultaneous exposure mask aligners 'BS425' and 'BS620' have a proven track record in both research and development and small to medium lot production. They adopt a method where the primary exposure is simultaneous on both sides, and subsequent exposures are done one side at a time, making them simple and versatile, with customization available to meet specific needs. Since the secondary exposure and beyond are done on one side, a separate "sample stage" is required. Please feel free to contact us. 【Features】 ■ Supports maximum φ4 inch wafers 'BS425' ■ Supports maximum φ6 inch wafers 'BS620' ■ Compact design ■ Semi-automatic operation possible during primary exposure with a footswitch ■ Easy to accommodate non-standard shape samples due to the hand placement style ■ Equipped with wafer positioning guide (optional) and more *For more details, please refer to the catalog or feel free to contact us.

  • Other semiconductor manufacturing equipment

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Double-sided mask aligner

Both-side alignment and the ability for proximity and soft contact exposure are possible.

It is a mask aligner that aligns a glass mask and a workpiece in the photolithography process for wafers and glass substrates, transferring a fine mask pattern onto the photoresist coated on the plate.

  • Stepper

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SUSS MicroTec Manual Mask Aligner MJB4

Manual exposure machine compatible with up to 4-inch square substrates.

The ZS Microtech MJB4 is a manual mask aligner (exposure device) that can accommodate substrates up to 4 inches square. It features simple operability, high-precision alignment, and high exposure resolution. It can be used not only for research and development purposes but also for small-scale production.

  • Stepper
  • Ultraviolet irradiation equipment

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Mask aligner

Our company's unique multilayer film deposition multi-mirror lamp house-equipped device.

■ Adoption of a multi-mirror lamp house results in a highly uniform illumination distribution. ■ Improved operability with the adoption of various automatic mechanisms, allowing for semi-automatic use. ■ The alignment microscope features a trinocular tube. Alignment via a monitor is also possible (optional).

  • Other semiconductor manufacturing equipment

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UV-LED light source! Automatic exposure device for semiconductor manufacturing | Mask aligner

This is an exposure device that has replaced the light source from a mercury lamp to an LED. It features automatic parallel adjustment, complete non-contact gap management, and auto-alignment functions.

This product is an automatic batch equal magnification exposure device (mask aligner) equipped with a UV-LED light source. One of our features is that it allows for fully non-contact automatic parallel adjustment of the stage and mask for the photomask and wafer. By incorporating a super-precision UVW drive stage and performing high-performance image processing, the alignment of the photomask and wafer is also carried out accurately. It supports exposure methods including proximity, soft, and hard contact. We offer a lineup that matches production volume, from manual machines to fully automatic machines, and since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. 【Features】 ■ Compatible with i-line (365nm) and H-line (405nm)! (Please consult us for g-line) ■ Non-contact parallel alignment and exposure of photomask and wafer ■ Auto-alignment function ■ Easy setup change and compatible with multiple substrate sizes ■ Space-saving & easy maintenance ■ Achieves low cost and compact design, suitable for small-batch production of various types ■ Equipped with a super-precision UVW stage *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment

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Manual Double-Sided Mask Aligner 'BA100/160/200'

The illumination distribution of the exposure light source is within ±5%! A lineup of desktop and standalone models is available.

The "BA100/160/200" is a manual double-sided mask aligner that achieves high positional accuracy patterning on both the top and bottom sides. In addition to the desktop models "BA100" for 4-inch wafers and "BA160" for 6-inch wafers, there is also a standalone model "BA200" for 8-inch wafers. Furthermore, the alignment accuracy is ±2μm on the top side and ±5μm on the bottom side. 【Specifications (excerpt)】 ■ Wafer size: 4in/6in/8in ■ Exposure light source intensity distribution: within ±5% ■ Exposure resolution ・Soft contact: L/S 3μm ・Hard contact: L/S 1μm *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Mask aligner

You can create an optimal system configuration with a semi-custom setup.

In addition to the general-purpose mask aligner ES20 series, we offer a variety of products including a wafer double-sided exposure type and a back-side observation mask aligner. We also accept custom equipment development and manufacturing tailored to customer specifications for photolithography-related devices and MEMS research and development support equipment.

  • Coater
  • Other semiconductor manufacturing equipment

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SUSS MicroTec Manual Mask Aligner MA/BAGen4

Compatible with substrates up to 8 inches and supports semi-auto alignment exposure equipment.

The Zeiss Microtech MA/BA GEN4 is a semi-auto alignment exposure machine capable of handling substrates up to 8 inches square. It is equipped with optimal features for R&D and small-scale production applications in MEMS, optical components manufacturing, and compound semiconductors. The optimized alignment mark observation optical system and image processing capabilities enable precise alignment with minimal variation.

  • Stepper
  • Ultraviolet irradiation equipment

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[Research Material] Global Market for Lithography Equipment

World Market for Lithography Equipment: Mask Aligners, Laser Direct Imaging, Projection, Laser Ablation, ...

This research report (Global Lithography Equipment Market) investigates and analyzes the current status and outlook for the global lithography equipment market over the next five years. It includes information on the global lithography equipment market overview, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the lithography equipment market include mask aligners, laser direct imaging, projection, and laser ablation, while the segments by application focus on MEMS devices, advanced packaging, and LED devices. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of lithography equipment. The report also includes the market share of major companies in lithography equipment, product and business overviews, and sales performance.

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